6월 23일 미국 등록특허

기업별 새 특허

많이 받은 기업의 특허

많이 받은 12곳만, 기업마다 AI·반도체 특허를 앞에 두고 최대 5건까지 보여 줘요(원문 제목, 누르면 구글 특허로 이동).

삼성전자 154건

• Semiconductor packageUS 12667026반도체
• Package device including capacitor disposed on opposite side of die relative to substrateUS 12667023반도체
• Semiconductor packageUS 12667019반도체
• Diode and bipolar junction transistor for 3D SFET with BSPDN structureUS 12667007반도체
• Semiconductor packageUS 12666989반도체

퀄컴 88건

• Package comprising a substrate with post interconnects and a solder resist layer having a cavityUS 12667029반도체
• Integrated device comprising pillar interconnects with variable widthsUS 12666991반도체
• Die package with guard structure to reduce or prevent material seepage into air cavity, and related fabrication methodsUS 12666972반도체
• Field-effect transistors (FETs) employing thermal expansion of work function metal layers for strain effect and related fabrication methodsUS 12666650반도체
• Mobility handling of cross-node machine learning session in a radio access networkUS 12666316AI

TSMC 77건

• Hybrid underfill structures for multi-die packages and methods of forming the sameUS 12667020반도체
• Semiconductor device including multi-dimension through silicon via structures for backside alignment and thermal dissipationUS 12667018반도체
• Semiconductor device that uses bonding layer to join semiconductor substrates togetherUS 12667000반도체
• Semiconductor device and manufacturing method thereofUS 12666998반도체
• Semiconductor structure and method for forming the sameUS 12666997반도체

델 70건

• Artificial intelligence-based chatbot system with machine learning-based processing of data structuresUS 12665866AI
• Robust multi-model event detection with unreliable sensorsUS 12664447AI
• Cross-customer weighted federated domain adaptation for event detection in warehousesUS 12664405AI
• Framework for estimation of resource usage and execution time of workloads in a heterogeneous infrastructureUS 12664396AI
• Systems and methods for combined retention of riser assemblies and expansion cards housed thereinUS 12666559

애플 54건

• Barriers for selective exposed molding of variable height componentsUS 12667024반도체
• Systems and methods for semantic communication for cyber securityUS 12665946AI
• Activity zone for camera videoUS 12664666AI
• Deep learning based causal image reprojection for temporal supersampling in AR/VR systemsUS 12664608AI
• TRP-specific PUSCH transmissions for multi-TRP operationUS 12666443

IBM 51건

• Clustering fine pitch micro-bumps for packaging and testUS 12667012반도체
• Flexible wiring architecture for multi-die integrationUS 12666958반도체
• MRAM bottom electrode shroudUS 12666880반도체
• Stacked hybrid TFET and MOSFETUS 12666711반도체
• Vertical transport transistor devices with back side interconnectsUS 12666682반도체

LG전자 49건

• Display device using semiconductor light emitting device with reduced surface adsorption during self-assemblyUS 12666764반도체
• Graphene-based biosensorUS 12666654반도체
• Home appliance and heat sink installed thereinUS 12666524
• Door opening speed controller and automatic opening structure for an applianceUS 12666505
• Electric rangeUS 12666504

에릭슨 43건

• Federated learning processUS 12665909AI
• Distributed machine learningUS 12665816AI
• Methods, apparatus and machine-readable media relating to data analytics in a communications networkUS 12664465AI
• Path section between Uu and PC5US 12666473
• Methods, UE and network node for handling a bandwidth part configurationUS 12666461

인텔 42건

• Integrated circuit packages with hybrid bonded dies and methods of manufacturing the sameUS 12667006반도체
• Integrated packaging architecture with solder and non-solder interconnectsUS 12667001반도체
• Methods, systems, apparatus, and articles of manufacture for integrated circuit package substrates with high aspect ratio through glass viasUS 12666977반도체
• Incorporation of superlattice semi-metals for scaled interconnectsUS 12666956반도체
• Metal routing that overlaps NMOS and PMOS regions of a transistorUS 12666950반도체

소니 41건

• Semiconductor deviceUS 12665019AI반도체
• Semiconductor deviceUS 12666983반도체
• Display device, light-emitting device, and electronic apparatusUS 12666790반도체
• Solid-state imaging device and electronic apparatusUS 12666747반도체
• Solid-state imaging device, manufacturing method of solid-state imaging device, and electronic apparatusUS 12666746반도체

알파벳(구글) 34건

• Joint detection and grouping of road objects using machine learningUS 12664790AI
• Reinforcement learning with information retrieval feedbackUS 12664478AI
• Learning unified embeddingUS 12664419AI
• Efficient use of physical and logical resources in dual connectivityUS 12666485
• Managing UE information after preparing a conditional mobility procedureUS 12666312

아마존 33건

• Automated item listing generation systemUS 12664570AI
• Shadow testing of contextual machine learning modelsUS 12664484AI
• Confidential tuning of pre-trained machine learning modelsUS 12664468AI
• Generating machine learning model host system recommendations using multi-objective optimizationUS 12664446AI
• Acceleration of neural networks with stacks of convolutional layersUS 12664430AI