5월 12일 미국 등록특허

기업별 새 특허

많이 받은 기업의 특허

많이 받은 12곳만, 기업마다 AI·반도체 특허를 앞에 두고 최대 5건까지 보여 줘요(원문 제목, 누르면 구글 특허로 이동).

삼성전자 177건

• Processing device and electronic device having the sameUS 12626115AI반도체
• Device and method with multidimensional vector neural networkUS 12626089AI반도체
• Semiconductor package having protrusions from redistribution wiring layer and method of manufacturing the semiconductor packageUS 12628712반도체
• Integrated circuit package, electronic device including the same, and manufacturing method thereofUS 12628711반도체
• Semiconductor package having two-dimensional input and output deviceUS 12628709반도체

퀄컴 110건

• Integrated bare die package, and related fabrication methodsUS 12628694반도체
• Power gating switch tree structure for reduced wake-up time and power leakageUS 12628639반도체
• Deep trench capacitors (DTCs) employing bypass metal trace signal routing, and related integrated circuit (IC) packages and fabrication methodsUS 12628429반도체
• Three-dimensional (3D) field effect transistors (FETs) with gate cuts to enhance carrier mobility and related fabrication methodsUS 12628417반도체
• Post-replacement metal gate (RMG) gate cut for performance enhanced FinFETUS 12628415반도체

IBM 70건

• Buried via-to-backside power rail (VBPR) for stacked field-effect transistor (FET)US 12628638반도체
• Back end of line interconnect structureUS 12628637반도체
• Semiconductor structure with top via having extended bottom contactUS 12628636반도체
• Via resistance reductionUS 12628634반도체
• Forksheet field effect transistor including self-aligned gateUS 12628627반도체

델 64건

• System and method for reduction of data transmission by data reconstructionUS 12626164AI
• Model parameter sharing between inference application instances in processing unit of information processing systemUS 12626163AI
• Managing impact of poisoned inferences on deployments of hardware to downstream consumersUS 12626160AI
• Pluggable LED bezel systemUS 12628307
• Dimple on circuit board for providing standoff between circuit board and circuit packageUS 12628270

애플 55건

• Electronic devices having semiconductor sensors with metal optical filtersUS 12628452반도체
• Layer 2 relay protocols and mobility relay methodUS 12628209
• Terminal, system, and method for bandwidth part out-of-sync detection and recoveryUS 12628143
• Network identification collision detection for private networksUS 12628107
• System and method for performing fast transmission output power transitionUS 12628097

TSMC 47건

• Giga interposer integration through chip-on-wafer-on-substrateUS 12628713반도체
• Semiconductor package and method of forming sameUS 12628706반도체
• Multi-layer electronic device interconnection method and structureUS 12628698반도체
• Package structure and manufacturing method thereofUS 12628697반도체
• Semiconductor device and method of manufacturing the sameUS 12628687반도체

알파벳(구글) 38건

• Interfacing between digital assistant applications and navigation applicationsUS 12626694AI
• Baseline and shaped pulse driving for micro-light emitting diode displayUS 12626645반도체
• Multimodal embeddingsUS 12626495AI
• Scalable transfer learning with expert modelsUS 12626194AI
• Machine learning models for behavior understandingUS 12626106AI

노키아 34건

• Obtaining machine learning (ML) models for secondary method of orientation detection in user equipment (UE)US 12628121AI
• Retrieval of trained ML model from UEUS 12628019AI
• Method, an apparatus and a computer program product for video codingUS 12627811AI
• Radio receiverUS 12627536AI
• Runtime assessment of sensorsUS 12622647AI

마이크론 32건

• Layouts of data pads on a semiconductor dieUS 12628690반도체
• Layouts of data pads on a semiconductor dieUS 12628431반도체
• Array of capacitors, an array of memory cells, method used in forming an array of memory cells, methods used in forming an array of capacitors, and methods used in forming a plurality of horizontally-spaced conductive linesUS 12628428반도체
• Methods used in forming a memory array comprising strings of memory cells including selective depositing of siliconUS 12628342반도체
• Edge server with deep learning accelerator and random access memoryUS 12627726AI

인텔 32건

• Techniques to enable a flip chip underfill exclusion zoneUS 12628686반도체
• Device and method of very high density routing used with embedded multi-die interconnect bridgeUS 12628676반도체
• Through glass via with a metal wallUS 12628669반도체
• Chip-scale package architectures containing a die back side metal and a solder thermal interface materialUS 12628645반도체
• Metal line profile shaping for advanced integrated circuit structure fabricationUS 12628640반도체

아마존 31건

• Language model hallucination mitigation using contrastive decodingUS 12626691AI
• Automated contribution analysis for question answeringUS 12626158AI
• Gradient exchange using adaptable hyper-rectangleUS 12626137AI
• Continual machine learning in a provider networkUS 12626128AI
• Execution of machine-trained networkUS 12626121AI

에릭슨 29건

• Methods for improved federated machine learning in wireless networksUS 12628224AI
• Network node and a method performed in a wireless communication network for handling configuration of radio network nodes using reinforcement learningUS 12628006AI
• Server and agent for reporting of computational results during an iterative learning processUS 12627573AI
• Adaptive beam filter for mobile communication systemsUS 12627357AI
• Terminal device, network node, and methods therein for DRX configurationUS 12628241