4월 7일 미국 등록특허

기업별 새 특허

많이 받은 기업의 특허

많이 받은 12곳만, 기업마다 AI·반도체 특허를 앞에 두고 최대 5건까지 보여 줘요(원문 제목, 누르면 구글 특허로 이동).

삼성전자 116건

• Display module and display deviceUS 12599044반도체
• Three-dimensional integrated circuit structure and a method of fabricating the sameUS 12599040반도체
• Semiconductor packageUS 12599037반도체
• Semiconductor packages having adhesive membersUS 12599028반도체
• Non-volatile memory device including first and second monitoring channel structures and non-volatile memory system comprising the sameUS 12599000반도체

퀄컴 64건

• Port landing-free low-skew signal distribution with backside metallization and buried railUS 12598981반도체
• Resettable level shifting latchUS 12597929반도체
• Constrained masking for sparsification in machine learningUS 12596916AI
• Bank-based refresh for a memory deviceUS 12596480반도체
• FR2-2 energy detection threshold adaptation with target listen before talk sensing bandwidthUS 12598646

델 52건

• Flip chip packageUS 12599016반도체
• Method and system for deployment of prediction models using sketches generated through distributed data distillationUS 12596932AI
• Environment detection and optimization for an information handling systemUS 12596825AI
• Prediction of table column items in unstructured documents using a hybrid modelUS 12596728AI
• Framework for failure detection, forecasting and remediation combining domain-specific telemetry and customized machine learning modelsUS 12596599AI

IBM 44건

• Multi-chip die alignmentUS 12598999반도체
• Metal insulator metal capacitor (MIM capacitor)US 12598986반도체
• Interconnects formed using integrated damascene and subtractive etch processingUS 12598983반도체
• Front end of line processing compatible thermally stable buried power railsUS 12598980반도체
• Top via on subtractively etched conductive lineUS 12598970반도체

마이크로소프트 41건

• Thermal transfer structures for immersion coolingUS 12598724반도체
• Tracking three-dimensional geometric shapesUS 12597155AI
• Machine-learned model including incrementality estimationUS 12596943AI
• Weak neural architecture search (NAS) predictorUS 12596908AI
• Contextualization of generative language models based on entity resource identifiersUS 12596888AI

LG전자 41건

• Chip tray for self-assembly, and method for supplying semiconductor light emitting elementsUS 12598944반도체
• Light-emitting element and display device comprising sameUS 12598852반도체
• Wireless communication method using on-device learning-based machine learning networkUS 12598483AI
• Method for performing transfer learning, communication device, processing device, and storage mediumUS 12598112AI
• Display deviceUS 12598095AI

소니 40건

• Solid-state imaging element and manufacturing method thereofUS 12598830반도체
• Solid-state imaging device and manufacturing method thereforUS 12598827반도체
• Display device and electronic apparatusUS 12598678반도체
• Transmitting image dataUS 12598331AI
• Memory device and memory systemUS 12597455반도체

애플 38건

• Dual contact and power rail for high performance standard cellsUS 12598979반도체
• Foldable cover and display for an electronic deviceUS 12596407반도체
• Inter-device communicationUS 12598638
• Uplink transmission in a new radio system operating on unlicensed spectrumUS 12598637
• Uplink control information for enabling autonomous uplink transmissionsUS 12598604

인텔 36건

• Multi-level die coupled with a substrateUS 12599050반도체
• Microelectronic structure including active base substrate with through vias between a top die and a bottom die supported on an interposerUS 12599034반도체
• Quasi-monolithic integrated packaging architecture with mid-die serializer/deserializerUS 12599033반도체
• Bilayer memory stacking with lines shared between bottom and top memory layersUS 12599032반도체
• Semiconductor packages for stacked memory-on-package (SMOP) and methods of manufacturing the sameUS 12599013반도체

TSMC 36건

• Carrier structure and methods of forming the sameUS 12599042반도체
• Semiconductor package and methodUS 12599031반도체
• Package structure and method of forming the sameUS 12599029반도체
• Package structure with enhancement structure and manufacturing method thereofUS 12599018반도체
• Semiconductor structure and method for forming the sameUS 12599011반도체

마이크론 27건

• Semiconductor packages with patterns of die-specific informationUS 12599026반도체
• Microelectronic devices, and related memory devices, electronic systems, and methodsUS 12598973반도체
• Methods used in forming a memory array comprising strings of memory cells including insulator walls in a through-array-via regionUS 12598972반도체
• Solid state optoelectronic device with preformed metal support substrateUS 12598845반도체
• Memory array comprising strings of memory cells and method used in forming a memory array comprising strings of memory cellsUS 12598742반도체

에릭슨 25건

• Data transmission using data prioritizationUS 12596962AI
• Communication device comprising mobile termination device and radio base stationUS 12598673
• Sensing coordinationUS 12598649
• Reference resource for downlink preemption in NR-UUS 12598642
• Prioritization for scheduling request and physical uplink shared channel without logical channel associationUS 12598606