3월 31일 미국 등록특허

기업별 새 특허

많이 받은 기업의 특허

많이 받은 12곳만, 기업마다 AI·반도체 특허를 앞에 두고 최대 5건까지 보여 줘요(원문 제목, 누르면 구글 특허로 이동).

삼성전자 118건

• Vertical nonvolatile memory device including gate electrodes with metal-doped grapheneUS 12593449AI반도체
• Semiconductor packageUS 12593737반도체
• Semiconductor device and method for manufacturing the sameUS 12593715반도체
• Semiconductor device including bonding enhancement layer and method of forming the sameUS 12593714반도체
• Semiconductor package including stacked semiconductor devices and method of manufacturing the semiconductor packageUS 12593708반도체

퀄컴 56건

• Substrate(s) for an integrated circuit (IC) package employing a core layer and an adjacent insulation layer(s) with an embedded metal structure(s) positioned from the core layerUS 12593709반도체
• Hybrid core substrate with embedded componentsUS 12593705반도체
• Package substrate having embedded electronic component in a core of the package substrateUS 12593408반도체
• Reference signals sampling and imputation for enabling parameter estimation via deep learningUS 12592847AI
• Machine learning model validation with verification dataUS 12591773AI

델 51건

• Ethical confidence fabrics: measuring ethical algorithm developmentUS 12591827AI
• Far edge/IOT intelligence design and apparatus for human operators assistanceUS 12591791AI
• Ordering infrastructure using application termsUS 12591774AI
• Cross-instance intelligent resource pooling for disparate databases in cloud native environmentUS 12591760AI
• Data processing system management using predictive implications of user actionsUS 12591479AI

TSMC 47건

• Semiconductor device and manufacturing method thereofUS 12593732반도체
• Method of forming opening in passivation layer and structures thereofUS 12593712반도체
• Bonding structure with stress buffer zone and method of forming sameUS 12593711반도체
• Semiconductor structure and manufacturing method thereofUS 12593707반도체
• Three-dimensional semiconductor device and methodUS 12593704반도체

LG전자 33건

• Substrate assembly of display device using light-emitting diode and method for manufacturing sameUS 12593734반도체
• Display device using semiconductor light-emitting diodes, and method for manufacturing sameUS 12593727반도체
• Self-assembly deviceUS 12593652반도체
• Display device using micro LED and modular display device using sameUS 12593551반도체
• Display apparatus and manufacturing method therefor, and multi-screen display apparatus using sameUS 12593544반도체

애플 32건

• Methods, system, user equipment, and apparatus for uplink resource muting operation in wireless communicationUS 12593333
• Location estimation for reduced capacity devicesUS 12593297
• Timing advance in layer 1/layer 2 intercell mobilityUS 12593251
• Crowdsourced data assisted personalized network slicingUS 12593224
• Electronic device with reliable passthrough video fallback capability and hierarchical failure detection schemeUS 12593023

마이크로소프트 31건

• Selective just-in-time transcodingUS 12593055AI
• Deep contextual video image compressionUS 12593044AI
• Self-supervised system generating embeddings representing sequenced activityUS 12591903AI
• Generating rule lists from tree ensemble modelsUS 12591817AI
• Dynamically enriching shared knowledge graphsUS 12591792AI

IBM 29건

• Shallow and deep contacts with stitchingUS 12593668반도체
• Phase change multilayer heterostructure with multiple heatersUS 12593621반도체
• MRAM device with wrap-around top electrode contactUS 12593615반도체
• MRAM device with annular electrodesUS 12593614반도체
• Stacked fork sheet devicesUS 12593501반도체

마이크론 26건

• Apparatus including integrated segments and methods of manufacturing the sameUS 12593719반도체
• Multi-chip package with enhanced conductive layer adhesionUS 12593706반도체
• Thermal management of GPU-HBM package by microchannel integrated substrateUS 12593692반도체
• Integrated assemblies having liners or rings surrounding regions of conductive postsUS 12593680반도체
• Apparatuses and memory devices including air gaps between conductive linesUS 12593679반도체

소니 25건

• Display device with light emission separation layers of differing thicknessesUS 12593583반도체
• Semiconductor packageUS 12593524반도체
• Solid-state imaging device, drive method thereof and electronic apparatusUS 12593517반도체
• Image and video processing circuitry and method using an image signatureUS 12592091AI
• Data generating method, learning method, estimating method, data generating device, and programUS 12592058AI

알파벳(구글) 23건

• Optimizing content distribution using a modelUS 12591806AI
• Boosting and matrix factorizationUS 12591636AI
• Computer session management using a language modelUS 12591605AI
• Touch sensor integration with enlarged active area displaysUS 12591326반도체
• Thermal imaging for self-driving carsUS 12590841AI

인텔 21건

• Structure and process for warpage reductionUS 12593695반도체
• Technologies for scalable spin qubit readoutUS 12593620반도체
• Dual contact process with selective depositionUS 12593486반도체
• Voltage contrast structure for trench connectorsUS 12593471반도체
• Flexible deterministic finite automata (DFA) tokenizer for AI-based malicious traffic detectionUS 12592958AI