3월 17일 미국 등록특허

기업별 새 특허

많이 받은 기업의 특허

많이 받은 12곳만, 기업마다 AI·반도체 특허를 앞에 두고 최대 5건까지 보여 줘요(원문 제목, 누르면 구글 특허로 이동).

삼성전자 170건

• Device including first structure having peripheral circuit and second structure having gate layersUS 12582011반도체
• Semiconductor package including padsUS 12582009반도체
• Semiconductor light emitting device, display apparatus including the same, and method of manufacturing the sameUS 12581999반도체
• Semiconductor device and method of fabricating the sameUS 12581989반도체
• Semiconductor package including under bump metallization padUS 12581978반도체

퀄컴 93건

• Electronic component placed on core of substrateUS 12581966반도체
• Through molding contact enabled EMI shieldingUS 12581956반도체
• Three-dimensional (3D) metal-insulator-metal capacitor (MIMCAP) including stacked vertical metal studs for increased capacitance density and related fabrication methodsUS 12581943반도체
• Via alternate net spacingUS 12581713반도체
• Transistor devices with double-side contactsUS 12581692반도체

TSMC 62건

• Redistribution layers and methods of fabricating the same in semiconductor devicesUS 12581987반도체
• Pad design for reliability enhancement in packagesUS 12581985반도체
• Bonding through multi-shot laser reflowUS 12581977반도체
• Semiconductor device and method of forming thereofUS 12581941반도체
• Contact structure manufacturing methodUS 12581939반도체

알파벳(구글) 52건

• Indium gallium nitride light emitting diodes with reduced strainUS 12581773반도체
• Automatic speech recognition accuracy with multimodal embeddings searchUS 12579995AI
• Generating transcriptions of audio data for presentation at a client deviceUS 12579985AI
• Schema-guided response generationUS 12579482AI
• Iterative supervised learning of quantum processor error modelsUS 12579460AI

애플 51건

• Method and apparatus for improving reliability and reducing power consumption for FR2 RRMUS 12581557
• Multi-link single radio suspension and operating parametersUS 12581416
• Multi-link device load signaling and use in WLANUS 12581356
• Location data harvesting and pruning for wireless accessory devicesUS 12581268
• Electronic device with a layered sealUS 12581224

LG전자 51건

• Display deviceUS 12581780반도체
• Method and device for adjusting split point in wireless communication systemUS 12581350AI
• Feature encoding/decoding method and device, and recording medium storing bitstreamUS 12581134AI
• Method for supporting service continuity when disaster situation ends, and device supporting sameUS 12581569
• Method and apparatus for operating DRX timer by user equipment in wireless communication systemUS 12581565

델 47건

• Analyzing message flows to select action clause paths for use in management of information technology assetsUS 12579455AI
• Firmware-based orchestration of artificial intelligence (AI) performance profiles in heterogeneous computing platformsUS 12579046AI
• Reinforcement learning space state pruning using Restricted Boltzmann MachinesUS 12579001AI
• Method and apparatus for an automatic battery heat sinking operation control mechanismUS 12581614
• Pivot latch hardware for a node of an information handling systemUS 12581608

IBM 46건

• Half metallic Heusler multilayers with perpendicular magnetic anisotropyUS 12581868반도체
• Backside power viaUS 12581723반도체
• Fabrication of silicon germanium channel and silicon/silicon germanium dual channel field-effect transistorsUS 12581719반도체
• Common self aligned gate contact for stacked transistor structuresUS 12581702반도체
• Multistack metal-insulator-metal (MIM) structure using spacer formation process for heterogeneous integration with discrete capacitorsUS 12581667반도체

마이크로소프트 44건

• Side-gated semiconductor-superconductor hybrid devicesUS 12581869반도체
• Entity maliciousness analysis using autonomous artificial intelligence agentsUS 12580951AI
• Transforming content across visual mediums using artificial intelligence and user generated mediaUS 12579710AI
• Systems and methods for distributing layers of special mixture-of-experts machine learning modelsUS 12579470AI
• Decentralized cross-node learning for audience propensity predictionUS 12579467AI

인텔 40건

• Interposer interconnects and enclosure for silicon photonics LIDAR moduleUS 12581996반도체
• Microelectronic assemblies with through die attach film connectionsUS 12581988반도체
• Electrically conductive strips on a side of a memory moduleUS 12581972반도체
• Package architecture of large dies using quasi-monolithic chip layersUS 12581968반도체
• Package architecture for quasi-monolithic chip with backside powerUS 12581938반도체

소니 40건

• Solid-state imaging device and electronic equipmentUS 12581766반도체
• Solid-state imaging device and electronic apparatusUS 12581758반도체
• Imaging device having insulated amplification transistorUS 12581220반도체
• Image sensor and imaging deviceUS 12581176반도체
• Image display device and electronic device including pixels in respective light emitting regions with differently sized light-emitting areasUS 12579915반도체

아마존 37건

• Safe and robust robotic picking of items based on reference image and item attributesUS 12579652AI
• Taxonomy management for labeling data for training machine learning modelsUS 12579469AI
• Meta-models for predicting machine learning model performance using features obtained via optimizationUS 12579464AI
• Neural network inference circuit with piecewise linear activation circuitUS 12579416AI
• Learning ordinal regression model via divide-and-conquer techniqueUS 12579215AI