2026년 2월 3일 등록
2월 3일 미국 등록특허
이날 실용특허 4,722건이 등록됐어요. AI 핵심기술 200건, 반도체 463건이고, 분석 대상 142곳 가운데 83곳이 새 특허를 받았어요.
기업별 새 특허
| 기업 | 전체 | AI 핵심기술 | 반도체 |
|---|---|---|---|
| 삼성전자 | 131 | 6 | 35 |
| 퀄컴 | 54 | 3 | 2 |
| TSMC | 52 | 1 | 45 |
| 델 | 41 | 2 | 0 |
| 애플 | 37 | 1 | 2 |
| IBM | 34 | 15 | 3 |
| 인텔 | 32 | 3 | 12 |
| 소니 | 29 | 3 | 6 |
| 에릭슨 | 27 | 1 | 0 |
| 마이크로소프트 | 27 | 2 | 0 |
| 마이크론 | 27 | 0 | 17 |
| 알파벳(구글) | 26 | 0 | 0 |
| LG전자 | 25 | 0 | 3 |
| LG디스플레이 | 24 | 0 | 14 |
| 노키아 | 24 | 0 | 0 |
| 아마존 | 20 | 2 | 0 |
| 시스코 | 17 | 0 | 0 |
| 오라클 | 16 | 4 | 0 |
| ST마이크로일렉트로닉스 | 13 | 0 | 5 |
| 삼성전기 | 12 | 0 | 1 |
나머지 63곳 보기
| 기업 | 전체 | AI 핵심기술 | 반도체 |
|---|---|---|---|
| SK하이닉스 | 12 | 1 | 9 |
| SAP | 12 | 3 | 0 |
| 엔비디아 | 12 | 4 | 1 |
| 어플라이드머티어리얼즈 | 11 | 0 | 5 |
| HPE | 8 | 0 | 0 |
| 아데이아 | 8 | 0 | 2 |
| 브로드컴 | 8 | 1 | 1 |
| AMD | 8 | 0 | 1 |
| 스냅 | 7 | 0 | 0 |
| 샌디스크 | 7 | 0 | 3 |
| 텍사스인스트루먼트 | 6 | 0 | 2 |
| 어도비 | 6 | 0 | 0 |
| 글로벌파운드리스 | 6 | 0 | 5 |
| 메타 | 5 | 0 | 0 |
| 스카이웍스 | 5 | 0 | 0 |
| 세일즈포스 | 5 | 4 | 0 |
| 마벨 | 5 | 0 | 0 |
| 팔로알토네트웍스 | 5 | 1 | 0 |
| NXP | 4 | 1 | 1 |
| 퓨어스토리지 | 4 | 0 | 1 |
| 삼성SDI | 4 | 0 | 1 |
| HP | 4 | 0 | 0 |
| 시에나 | 4 | 0 | 0 |
| Arm | 4 | 0 | 0 |
| 웨스턴디지털 | 4 | 0 | 0 |
| LG이노텍 | 4 | 0 | 1 |
| 인튜이트 | 3 | 2 | 0 |
| 램리서치 | 3 | 0 | 1 |
| 시놉시스 | 3 | 0 | 0 |
| 엔테그리스 | 3 | 0 | 0 |
| UMC | 3 | 0 | 3 |
| 씨게이트 | 3 | 0 | 1 |
| LG화학 | 3 | 0 | 1 |
| 코닝 | 2 | 0 | 1 |
| 알리바바 | 2 | 1 | 0 |
| 오토데스크 | 2 | 1 | 0 |
| 주성엔지니어링 | 2 | 0 | 2 |
| 팔란티어 | 2 | 0 | 0 |
| 유니버설디스플레이 | 2 | 0 | 2 |
| 테슬라 | 2 | 0 | 0 |
| 인스타카트 | 2 | 0 | 0 |
| 아날로그디바이스 | 2 | 0 | 0 |
| 코히어런트 | 2 | 0 | 0 |
| 케이던스 | 2 | 0 | 1 |
| 킨드릴 | 1 | 0 | 0 |
| 엔씨소프트 | 1 | 0 | 0 |
| KLA | 1 | 0 | 1 |
| 삼성SDS | 1 | 1 | 0 |
| 오로라이노베이션 | 1 | 0 | 0 |
| 실리콘모션 | 1 | 0 | 1 |
| 덕산네오룩스 | 1 | 0 | 1 |
| 이베이 | 1 | 1 | 0 |
| ASE테크놀로지 | 1 | 0 | 1 |
| 에스앤에스텍 | 1 | 0 | 0 |
| 서비스나우 | 1 | 0 | 0 |
| 우버 | 1 | 0 | 0 |
| 온세미 | 1 | 0 | 1 |
| 리프트 | 1 | 0 | 0 |
| 루닛 | 1 | 0 | 0 |
| 래피드7 | 1 | 0 | 0 |
| 알레그로마이크로시스템즈 | 1 | 0 | 1 |
| 바이두 | 1 | 0 | 0 |
| 솔브레인 | 1 | 0 | 1 |
많이 받은 기업의 특허
많이 받은 12곳만, 기업마다 AI·반도체 특허를 앞에 두고 최대 5건까지 보여 줘요(원문 제목, 누르면 구글 특허로 이동).
삼성전자 131건
- Semiconductor package and method of fabricating the sameUS 12543605반도체
- Semiconductor packageUS 12543603반도체
- Memory deviceUS 12543600반도체
- Semiconductor packageUS 12543580반도체
- Semiconductor deviceUS 12543565반도체
퀄컴 54건
- Package comprising a first substrate, a second substrate and an electrical device coupled to a bottom surface of the second substrateUS 12543599반도체
- Inductive device structure and process methodUS 12543328반도체
- Neural network-based in loop filter architectures with separable convolution and multi-scale enhancement for video codingUS 12542932AI
- Machine learning for wireless channel estimationUS 12542697AI
- Accumulator for digital computation-in-memory architecturesUS 12541340AI
TSMC 52건
- Computing-in-memory device and methodUS 12541319AI반도체
- Semiconductor devices and methods of forming the sameUS 12543612반도체
- Adding sealing material to wafer edge for wafer bondingUS 12543604반도체
- Semiconductor package including semiconductor dies having different lattice directions and method of forming the sameUS 12543593반도체
- Method of making package including stress relief structures and packageUS 12543571반도체
델 41건
- Method and system for generating machine learning training data streams using unstructured dataUS 12541717AI
- System and method of keyword-sensitive semantic search scoring for artificial intelligence productivity tool-enablable application capabilities for a user query inputUS 12541525AI
- Proactive timing advance acquisition for reducing handover interruption delayUS 12543090
- Systems and methods of automatic out-of-band (OOB) restricted cellular connectivity for set up provisioning of managed client information handling systemsUS 12543044
- Enhanced edge network peer-to-peer file downloadsUS 12542825
애플 37건
- Backside routing implementation in SRAM arraysUS 12543555반도체
- Memory calibration with reduced calibration parametersUS 12542189반도체
- Memory-efficient streaming convolutions in neural network processorUS 12541677AI
- Sidelink control information (SCI) in new radio (NR) unlicensedUS 12543220
- User equipment activity alignment for power savingsUS 12543204
IBM 34건
- Stacked field effect transistor contactsUS 12543554반도체
- Backside direct contact formationUS 12543544반도체
- Transition metal dichalcogenide (TMD) transistor structureUS 12543358반도체
- Dark pattern detection and mitigationUS 12542796AI
- Automatically classifying heterogenous documents using machine learning techniquesUS 12541991AI
인텔 32건
- Scalable package architecture using reticle stitching and photonics for integrated circuitsUS 12543594반도체
- Electronic packaging architecture with customized variable metal thickness on same buildup layerUS 12543578반도체
- Tunable stack-up DIMM form factor cold plate with embedded peltier devices for enhanced cooling capabilityUS 12543567반도체
- Self-aligned interconnect features for transistor contactsUS 12543558반도체
- Backside processing of fins in fin based transistor devicesUS 12543367반도체
소니 29건
- Imaging apparatus, electronic device, and signal processing methodUS 12542982AI반도체
- Display device and electronic device with multilayer cathode electrodeUS 12543476반도체
- Light-emitting device and display apparatusUS 12543420반도체
- Imaging deviceUS 12543398반도체
- Light-receiving element, X-ray imaging element, and electronic apparatusUS 12543389반도체
에릭슨 27건
- Translating sensory communicationsUS 12542835AI
- Handling of reestablishment failure ambiguityUS 12543236
- Determination of PRACH occasions and PUSCH occasions for 2-step random accessUS 12543213
- System information message transmission indicationUS 12543185
- Method and apparatus for supporting more users in a multicast groupUS 12543177
마이크로소프트 27건
- Automatic generation of assert statements for unit test casesUS 12541449AI
- Spatial-temporal memory uncorrectable error prediction systemUS 12541427AI
- Network storage accelerationUS 12542828
- Method and system for quantifying and improving conformance to least privilege security policiesUS 12542813
- Enabling SSO for embedded applicationsUS 12542771
마이크론 27건
- Separation method and assembly for chip-on-wafer processingUS 12543607반도체
- Stacked die modules for semiconductor device assemblies and methods of manufacturing stacked die modulesUS 12543583반도체
- Semiconductor systems with anti-warpage mechanisms and associated systems, devices, and methodsUS 12543572반도체
- Memory device including control gates having tungsten structureUS 12543559반도체
- Selective cavity merging for isolation regions in a memory dieUS 12543543반도체
알파벳(구글) 26건
- Method for operating a Bluetooth deviceUS 12543121
- Presenting information for a current location or timeUS 12543017
- Personalized recommendations for television sports contentUS 12542950
- Two-layered image compression for text contentUS 12542918
- Methods and systems for person detection in a video feedUS 12542874
관심 기업의 새 특허, 등록되는 주에 받아 보기
미국 특허청은 매주 화요일 특허를 등록해요. 관심 기업에 새 특허가 나오면 분야별로 정리해 보내는 알림을 12월에 열어요. 먼저 받아 볼 분은 이메일을 남겨 주세요.