1월 27일 미국 등록특허

기업별 새 특허

많이 받은 기업의 특허

많이 받은 12곳만, 기업마다 AI·반도체 특허를 앞에 두고 최대 5건까지 보여 줘요(원문 제목, 누르면 구글 특허로 이동).

삼성전자 152건

• Semiconductor packageUS 12538848반도체
• Three-dimensional storage device using wafer-to-wafer bondingUS 12538842반도체
• Light emitting diode chip and display apparatus including the sameUS 12538838반도체
• Semiconductor package and method of fabricating the sameUS 12538815반도체
• Semiconductor package including a barrier structure covering connection pads and contacting a protruding portion of an adhesive layerUS 12538803반도체

TSMC 66건

• Package structure containing chip structure with inclined sidewallsUS 12538852반도체
• Memory packages and methods of forming sameUS 12538851반도체
• Semiconductor package including semiconductor dies having different lattice directions and method of forming the sameUS 12538850반도체
• Seal ring structure in the peripheral of device dies and with zigzag patterns and method forming sameUS 12538836반도체
• Integrated chip package including a crack-resistant lid structure and methods of forming the sameUS 12538835반도체

퀄컴 53건

• Conditional cell selection based on beam predictionUS 12537613AI
• Effective leveraging of synthetic data for depth estimation machine learning modelsUS 12536681AI
• Federated learning model splitting and combiningUS 12536470AI
• RRC re-establishment and radio link failure reporting in sidelink relay systemsUS 12538375
• Sidelink collision handling for inter user equipment coordinationUS 12538346

델 47건

• Automated communication data summarization using artificial intelligence techniquesUS 12536476AI
• Workload prioritization fairness techniques in non-volatile memory express (NVMe) systemsUS 12535968AI
• Heatpipe with graduated condenser portion and constant ratio between wick thickness and cross-section areaUS 12535277반도체
• Thermo-haptics for a pointing device for gamingUS 12533576AI
• Bandwidth part adaptationUS 12538284

LG전자 45건

• Electrode structure of roller unit for transferring semiconductor light-emitting element and intelligent integrated assembling and transferring device comprising sameUS 12538736반도체
• Method for performing reinforcement learning by V2X communication device in autonomous driving systemUS 12536845AI
• Display deviceUS 12535858반도체
• Control for intelligent cooking deviceUS 12532985AI
• Display deviceUS 12538442

소니 41건

• Solid-state imaging element and electronic apparatusUS 12538635반도체
• Imaging element, laminated imaging element, and solid-state imaging deviceUS 12538604반도체
• Semiconductor device, solid-state imaging device, and method of manufacturing semiconductor deviceUS 12538603반도체
• Imaging deviceUS 12538600반도체
• Solid-state imaging device and electronic apparatusUS 12538592반도체

알파벳(구글) 36건

• Selective content masking for collaborative computingUS 12537994AI
• Device using neural network for combining cellular communication with sensor dataUS 12537746AI
• Language-agnostic multilingual modeling using effective script normalizationUS 12536989AI
• Training distilled machine learning modelsUS 12536478AI
• Training firewall for improved adversarial robustness of machine-learned model systemsUS 12536446AI

에릭슨 34건

• Network node and method for simultaneous transmissions in a wireless communications networkUS 12538369
• Device and method for virtual data session establishment to control load sharing within a fixed wireless access domain according to a predetermined criteriaUS 12538363
• Multiple starting and ending positions for scheduled or autonomous uplink transmission in unlicensed spectrumUS 12538355
• Scheduling communication of a wireless communication device in a communications networkUS 12538338
• Methods and apparatuses for enhanced configured grant for low-latency applicationsUS 12538319

인텔 33건

• SRAM-based in-memory computing macro using analog computation schemeUS 12537053AI반도체
• Quasi-monolithic die architecturesUS 12538841반도체
• Power delivery for embedded bridge die utilizing trench structuresUS 12538823반도체
• Substrate for improved heat dissipation and methodUS 12538797반도체
• Vertical diodes extending through support structuresUS 12538586반도체

마이크로소프트 32건

• Merging models on an edge serverUS 12536467AI
• Notification management and channel selectionUS 12536414AI
• Neural network target feature detectionUS 12536249AI
• Materials information database including machine learning modelsUS 12536175AI
• Installation script auto-generation to create source code runtime environmentUS 12536009AI

애플 32건

• Electronic devices including colored glass-based componentsUS 12538437
• Enhanced channel access mechanisms in shared radio wireless communicationUS 12538354
• Receive (RX) rate control for thread coexistence with other radiosUS 12538292
• Systems and methods for network performance monitoringUS 12538148
• Performance measurements related to PDU session and N4 session managementUS 12538144

IBM 31건

• Backside contact for semiconductor deviceUS 12538786반도체
• Fully-aligned and dielectric damage-less top via interconnect structureUS 12538785반도체
• Magneto-resistive random access memory with laterally-recessed free layerUS 12538714반도체
• Self-aligned bottom spacerUS 12538565반도체
• Contact structure for power delivery on semiconductor deviceUS 12538553반도체