11월 3일 미국 등록특허

기업별 새 특허

많이 받은 기업의 특허

많이 받은 12곳만, 기업마다 AI·반도체 특허를 앞에 두고 최대 5건까지 보여 줘요(원문 제목, 누르면 구글 특허로 이동).

삼성전자 245건

• Semiconductor packageUS 12787899반도체
• Display apparatusUS 12787892반도체
• Semiconductor package and method of manufacturing the semiconductor packageUS 12787882반도체
• Semiconductor chip and semiconductor package including the sameUS 12787879반도체
• Display module including bonding member connecting between light emitting diode and substrateUS 12787876반도체

퀄컴 126건

• Device comprising wall pillar interconnectsUS 12787898반도체
• Stacked integrated circuit devicesUS 12787878반도체
• Package substrate comprising embedded integrated deviceUS 12787819반도체
• Integrated device comprising elongated padsUS 12787721반도체
• Mitigation of visual defect in a displayUS 12787624반도체

TSMC 77건

• Structure and formation method of package with interposer chipUS 12787888반도체
• Package on package structure with encapsulated heat sinkUS 12787860반도체
• Method of fabricating semiconductor device having dummy micro bumps between stacking diesUS 12787844반도체
• Manufacturing method of package structure and package structure thereofUS 12787834반도체
• Package structure and method of fabricating the sameUS 12787832반도체

델 73건

• Generating context-based and user-related predictions using artificial intelligence techniquesUS 12786286AI
• Dynamic action classification using machine learning techniquesUS 12784066AI
• Component health determination and reporting systemUS 12783918AI
• Adaptive gradient compressor for federated learning with connected vehicles under constrained network conditionsUS 12783887AI
• Deep learning using a read skip mask commandUS 12783173AI

LG전자 59건

• Display device using light emitting diodesUS 12787579반도체
• Energy storage systemUS 12787235반도체
• Method and device for transmitting and receiving signal in wireless communication systemUS 12786073AI
• Display deviceUS 12787189
• Display device having fastening structure for module coverUS 12787187

IBM 58건

• Neuromorphic chip for updating precise synaptic weight valuesUS 12783860AI반도체
• Dual-side bridge chips connecting two semiconductor chips with stacked semiconductor devicesUS 12787880반도체
• Modular package structures with interposers having alignment featuresUS 12787795반도체
• Resistance temperature detector at hybrid bonding interfaceUS 12787793반도체
• Super via within backside levelUS 12787739반도체

애플 57건

• Organic light-emitting diodes with off-axis uniformityUS 12787610반도체
• Texture unit circuit in neural network processorUS 12783886AI
• Enhancement of handling intra-cell guard band for sidelink (SL) in unlicensed spectrumUS 12786969
• Configuration-based UE MSD reportingUS 12786887
• Concatenated physical layer convergence protocol (PLCP) protocol data units (PDUs)US 12786790

알파벳(구글) 51건

• Constructing and programming quantum hardware for robust quantum annealing processesUS 12783933AI반도체
• Low-defect optoelectronic devices grown by MBE and other techniquesUS 12787496반도체
• Processing images using self-attention based neural networksUS 12784279AI
• Utilizing elastic weight consolidation (EWC) loss term(s) to mitigate catastrophic forgetting in training machine learning model(s)US 12783956AI
• Privacy-preserving learning and analytics of a shared embedding space across multiple separate data silosUS 12783948AI

인텔 49건

• Package architecture with memory chips having different process regionsUS 12787869반도체
• Microelectronic assemblies including stacked dies coupled by a through dielectric viaUS 12787863반도체
• Memory on package (MOP) architectureUS 12787861반도체
• Laser assisted etching of dielectrics in IC devicesUS 12787851반도체
• Integrating and accessing passive components in wafer-level packagesUS 12787847반도체

소니 48건

• Sensor device with improved heat dissipationUS 12787776반도체
• Image pick-up apparatusUS 12787470반도체
• Semiconductor deviceUS 12787465반도체
• Photodetection element and photodetection deviceUS 12786582반도체
• Information processing device, information processing method, and information processing program for generating basis information indicating a basis for an output of a modelUS 12783847AI

에릭슨 48건

• Data input processingUS 12786044AI
• Quantum computing device in a support vector machine algorithmUS 12783965AI
• Method of producing a PCB, as well as a PCB, and a circuit boardUS 12787152
• Dynamic starting of the DRX retransmission timer for bounded latency applicationsUS 12787114
• User plane redundancy between user equipment and user plane functionUS 12787092

LG디스플레이 46건

• Light emitting display deviceUS 12787625반도체
• Display deviceUS 12787623반도체
• Light emitting display apparatusUS 12787621반도체
• Display deviceUS 12787619반도체
• Light emitting display deviceUS 12787613반도체