10월 20일 미국 등록특허

기업별 새 특허

많이 받은 기업의 특허

많이 받은 12곳만, 기업마다 AI·반도체 특허를 앞에 두고 최대 5건까지 보여 줘요(원문 제목, 누르면 구글 특허로 이동).

삼성전자 136건

• Semiconductor package and method of manufacturing a semiconductor packageUS 12772915반도체
• Semiconductor package and method of manufacturing the sameUS 12772912반도체
• Semiconductor packageUS 12772907반도체
• Method for manufacturing semiconductor devices without thickness deviationUS 12772904반도체
• Semiconductor package including crack prevention layerUS 12772886반도체

퀄컴 121건

• Tunable filter having a 3-D inductor and a cavity embedded die which includes a varactor and a capacitorUS 12772889반도체
• Package comprising an integrated device and a metallization portion with variable thickness metallization interconnects on a same metal layerUS 12772884반도체
• Memory cell structures using full backside connectivityUS 12772821반도체
• Domain merger cell to abut power domains for chip area reductionUS 12772558반도체
• Bottom channel trench isolated gate all around (GAA) field effect transistor (FET)US 12772500반도체

델 96건

• Architecture for refining mapped human experiences insights within a human experience flowUS 12770035AI
• System and method for identifying input features contributing to latent bias in inference modelsUS 12770023AI
• Service impairment isolation in information processing system environmentUS 12770014AI
• Method, apparatus, electronic device and medium for training modelsUS 12769807AI
• Machine learning-based generation of alert bundle self-healing policies for storage systemsUS 12769604AI

TSMC 64건

• Semiconductor package having dummy metal patternsUS 12772902반도체
• Semiconductor structure and method of making sameUS 12772882반도체
• Shielded through-substrate via structures for silicon interconnect dieUS 12772875반도체
• Redistribution structure with warpage tuning layerUS 12772844반도체
• Redistribution layer structures for integrated circuit packageUS 12772834반도체

IBM 58건

• Cooling for back side power distribution networkUS 12772847반도체
• Self-aligned zero track skipUS 12772828반도체
• Backside dielectric capUS 12772825반도체
• Asymmetric gate contact over source/drain contactUS 12772824반도체
• Backside contact with full wrap-around contactUS 12772823반도체

애플 50건

• Electronic package molded vertical interconnectionUS 12772885반도체
• Display systems with light-emitting diodesUS 12772644반도체
• Electrical testing for panel characterization and defect screeningUS 12768875반도체
• Fast radio link failure recoveryUS 12772317
• Home device interoperabilityUS 12772309

인텔 43건

• Back side power supply for electronic devicesUS 12772899반도체
• Air gap architecture for high speed I/O substrate tracesUS 12772880반도체
• Package substrate with embedded dies in buildup layersUS 12772879반도체
• Split metallization layers in multichip devicesUS 12772878반도체
• Packaging architecture with trench via routing for on-package high-speed interconnectsUS 12772877반도체

LG디스플레이 38건

• LED display apparatus with transferred substrate and manufacturing method of the sameUS 12772900반도체
• Organic light emitting diode and organic light emitting display device including the sameUS 12772731반도체
• Organic light emitting deviceUS 12772727반도체
• Display apparatusUS 12772723반도체
• Light emitting display deviceUS 12772706반도체

소니 35건

• Magnetoresistive element and magnetic memoryUS 12772744반도체
• Semiconductor deviceUS 12772479반도체
• Solid-state imaging device and comparison deviceUS 12771961반도체
• Image sensor and data structureUS 12771956AI
• Information processing apparatus, information processing method, and information processing programUS 12770594AI

마이크론 31건

• Methods of forming material within openings extending into a semiconductor construction, and semiconductor constructions having fluorocarbon materialUS 12772810반도체
• Memory device with laterally formed memory cellsUS 12772749반도체
• Memory arrays comprising strings of memory cells and methods used in forming a memory array comprising strings of memory cellsUS 12772449반도체
• Staggered horizontal cell architecture for memory devicesUS 12772438반도체
• Resetting integrated circuitsUS 12771329반도체

에릭슨 30건

• Method and apparatus for temperature and humidity control in an electrical enclosureUS 12772392
• Reporting UE-initiated network releaseUS 12772337
• Random access channel preamble collision resolution based on spatial informationUS 12772298
• Method for improving PN-NPN coexistenceUS 12772286
• Communication device power saving when communication device monitors multicast control channel notification channelUS 12772264

노키아 30건

• Iterative overfitting and freezing of decoder-side neural networksUS 12769981AI
• Triggering user equipment-side machine learning model update for machine learning-based positioningUS 12768933AI
• Optimized system information transmission on one or more detectable beamsUS 12772266
• Frequency domain resource set indication for REDCAP UEUS 12772257
• SRS bursts through MAC-CE enhancementUS 12772253