9월 15일 미국 등록특허

기업별 새 특허

많이 받은 기업의 특허

많이 받은 12곳만, 기업마다 AI·반도체 특허를 앞에 두고 최대 5건까지 보여 줘요(원문 제목, 누르면 구글 특허로 이동).

삼성전자 179건

• Semiconductor package including an edge region having a plurality of solder balls thereinUS 12740494반도체
• Semiconductor packageUS 12740491반도체
• Semiconductor packageUS 12740488반도체
• Semiconductor package and method of manufacturing the semiconductor packageUS 12740485반도체
• Semiconductor packageUS 12740482반도체

퀄컴 100건

• Stress mitigating pillar bumpsUS 12740467반도체
• Substrate structure including stacked substrates disposed in a shellUS 12740457반도체
• Integrated devices coupled to interposer comprising porous portionUS 12740445반도체
• Structure for delamination mitigation in a semiconductor deviceUS 12740420반도체
• Integrated device comprising stacked inductors with low or no mutual inductanceUS 12740406반도체

IBM 94건

• Bimetallic fuse element between metal levelsUS 12740405반도체
• Power rail lead for semiconductor structuresUS 12740399반도체
• Interconnect levels with multiple line typesUS 12740398반도체
• Subtractive lines and vias with wrap-around contactUS 12740394반도체
• Transistors with bottom dielectric isolation and fully self-aligned direct backside contactUS 12740388반도체

LG전자 51건

• Method and apparatus for transmitting and receiving signal in wireless communication systemUS 12739939
• Method for transmitting and receiving physical sidelink shared channel in wireless communication system, and device for sameUS 12739882
• Method and device for performing sensing procedure in wireless LAN systemUS 12739881
• Method for performing sidelink communication by terminal in wireless communication system and device thereforUS 12739880
• Method for performing channel access procedure and apparatus thereforUS 12739877

소니 49건

• Solid-state imaging device and electronic deviceUS 12740172반도체
• Imaging element with transmissive cover body and diffractive lens, imaging device with transmissive cover body and diffractive lens, and method for manufacturing imaging element with transmissive cover body and diffractive lensUS 12740171반도체
• Semiconductor chip and manufacturing method therefor, semiconductor device and manufacturing method therefor, and electronic deviceUS 12740169반도체
• Solid-state imaging element with Fin-type transistorsUS 12740167반도체
• Light detection device and electronic deviceUS 12740164반도체

알파벳(구글) 44건

• Light emitting diodes with aluminum-containing layers integrated therein and associated methodsUS 12740186반도체
• User-selected viewpoint rendering of a virtual meetingUS 12739346AI
• Automatic note taking and summary generation based on meeting discussionsUS 12739143AI
• Hot-word free pre-emption of automated assistant response presentationUS 12738268AI
• Self-training with oracle and top-ranked hypothesesUS 12738265AI

LG디스플레이 44건

• Organic light emitting diode and organic light emitting device including thereofUS 12740318반도체
• Organic light emitting elementUS 12740317반도체
• Organic light emitting diode and organic light emitting device including the sameUS 12740309반도체
• Organic light emitting diode and organic light emitting device having thereofUS 12740308반도체
• Display device including light absorbing layer and anti-reflection layersUS 12740300반도체

에릭슨 42건

• Transfer learning of machine learning model in distributed networkUS 12737638AI
• First network node and method performed therein for handling data in a communication networkUS 12737630AI
• Architecture for utilizing key-value store for distributed neural networks and deep learningUS 12737610AI
• Methods, node, UE and computer readable media for aligning partial sensing configuration with DRX configurationUS 12739934
• Wireless device, network node and methods performed thereby for handling transmission of dataUS 12739928

애플 39건

• Devices and methods for motion planning of computer charactersUS 12737992AI
• Electronic device including clad componentsUS 12739995
• Base station signaling for user equipment direct transmission while inactiveUS 12739924
• Systems and methods for multi-hop configurations in iab networks for reduced latencyUS 12739917
• Techniques for managing pairing procedures between computing devices and accessory computing devicesUS 12739904

델 37건

• Determining candidates for circuit breaker patterns in cloud applications using machine learning techniquesUS 12737667AI
• Distributed unit monitoring of radio unit transmitter performanceUS 12739757
• Device assisted intercell downlink radio synchronizationUS 12739747
• Purpose driven configured grant schedulingUS 12739695
• Handoff matching in a network meshUS 12739655

노키아 36건

• Change of multicast and broadcast services radio bearer identifiers during multicast and broadcast service mobilityUS 12739941
• DRX-enabled multipath communicationsUS 12739938
• Determine action to take in response to radio link failure in a network of IAB nodesUS 12739918
• Methods for PRACH occasion indexing and RO groups determinationUS 12739892
• Random accessUS 12739889

TSMC 34건

• Radiant substrate heating for thermocompressive bonding and apparatus for implementing the sameUS 12740484반도체
• Hybrid organic and non-organic interposer with embedded component in molding structure and methods for forming the sameUS 12740463반도체
• Package substrate including memory bridge dieUS 12740450반도체
• Deformation-resistant interposer for a local silicon interconnect and methods for forming the sameUS 12740448반도체
• Semiconductor package and method of fabricating semiconductor packageUS 12740446반도체