8월 11일 미국 등록특허

기업별 새 특허

많이 받은 기업의 특허

많이 받은 12곳만, 기업마다 AI·반도체 특허를 앞에 두고 최대 5건까지 보여 줘요(원문 제목, 누르면 구글 특허로 이동).

삼성전자 172건

• Semiconductor packageUS 12708051반도체
• Semiconductor package having a first package structure including a first redistribution structure and a second package structure including a second redistribution structureUS 12708041반도체
• Semiconductor deviceUS 12708016반도체
• Semiconductor package having first pad and second padUS 12708010반도체
• Semiconductor package with organic interposerUS 12708009반도체

퀄컴 96건

• Package comprising sidewall interconnects configured for power routingUS 12708057반도체
• Scene-adaptive online learning for video post processingUS 12707099AI
• Wideband current-scaled Doherty amplifierUS 12706569반도체
• Compute-in-memory with current transition detectionUS 12706128반도체
• Acoustic sensor systems with different heightsUS 12705919반도체

TSMC 78건

• Fabricating method of semiconductor die with tapered sidewall in packageUS 12708050반도체
• Semiconductor package and methodUS 12708049반도체
• Interconnect structure for front-to-front stacked chipsUS 12708048반도체
• Semiconductor device including cross-die bonding ring and methods for forming the sameUS 12708046반도체
• Method and structure for a three-dimensional packageUS 12708045반도체

마이크론 55건

• Data storage device with light emitted memoryUS 12708052반도체
• Semiconductor device with volumetrically-expanded side-connected interconnectsUS 12708042반도체
• Semiconductor device assemblies including monolithic silicon structures for thermal dissipation and methods of making the sameUS 12707967반도체
• Memory circuitry and method used in forming memory circuitryUS 12707950반도체
• Contact arrangements for transistorsUS 12707700반도체

LG전자 53건

• Display device using semiconductor light-emitting devicesUS 12707791반도체
• Display device using semiconductor light-emitting elementUS 12707783반도체
• Display deviceUS 12707774반도체
• Display device using semiconductor light-emitting elementsUS 12707770반도체
• Apparatus and method for handover in wireless communication systemUS 12707352AI

알파벳(구글) 50건

• Detection of information concealment and mitigation via introduction of deliberate varianceUS 12706926AI
• Processing images using mixture of expertsUS 12705703AI
• End to end platform to manage circular economy of waste materialsUS 12705583AI
• Determining hyperparameters using sequence generation neural networksUS 12705501AI
• Communication efficient federated learningUS 12705500AI

소니 50건

• Imaging device and imaging apparatusUS 12707796반도체
• Solid-state imaging element, imaging apparatus, and electronic deviceUS 12707751반도체
• Imaging element and electronic apparatusUS 12707750반도체
• Semiconductor device and imaging deviceUS 12707749반도체
• Semiconductor device with blocks including units with a protection element and a bump connected to a main unitUS 12707748반도체

마이크로소프트 44건

• Heterogeneously integrated liquid electrolyte powered processorUS 12707972반도체
• Knowledge base constructionUS 12705504AI
• Reduced power consumption analog or hybrid mac neural networkUS 12705474AI
• Mixture-of-experts layer with switchable parallel modesUS 12705455AI
• Efficient multi-turn generative AI model suggested message generationUS 12705418AI

애플 41건

• Back-off mechanisms for inter-cell mobilityUS 12707524
• Secondary cell group failure detection and reportingUS 12707523
• Technologies for listen-before-talk indication in high-frequency networksUS 12707497
• Resource allocation for variable-size data burstsUS 12707488
• User equipment (UE) and method for reporting to the network an indication that a single physical uplink control channel (PUCCH) group having a plurality of component carriers (CC) using more than four numerologies across the CCs is supportedUS 12707486

인텔 39건

• Singulation of integrated circuit package substrates with glass coresUS 12708014반도체
• Substrate with low-permittivity core and buildup layersUS 12708013반도체
• Transistor-scale thermoelectric devices for refrigeration of integrated circuitsUS 12707971반도체
• Conductive via structures for gate contact or trench contactUS 12707948반도체
• Handling assembly, handling system and methodUS 12707932반도체

에릭슨 38건

• Methods for inter-node reporting of energy consumption related informationUS 12707385AI
• Methods and apparatus for implementing reinforcement learningUS 12705537AI
• UE, networks nodes, and methods performed thereby, for handling RACH-reportsUS 12707501
• Beam indication in random accessUS 12707466
• Systems and methods for cooperative uplink transmissionUS 12707458

텍사스인스트루먼트 33건

• Sensor packagesUS 12708034반도체
• Interconnect stripsUS 12708022반도체
• Electronic package with concave lead end facesUS 12708008반도체
• Electronic device including vertical high current hall sensor with integrated heat slug current loop power padUS 12707992반도체
• Integrated circuit having a routable leadframeUS 12707986반도체