2026년 8월 4일 등록
8월 4일 미국 등록특허
이날 실용특허 5,209건이 등록됐어요. AI 핵심기술 233건, 반도체 568건이고, 분석 대상 142곳 가운데 84곳이 새 특허를 받았어요.
기업별 새 특허
| 기업 | 전체 | AI 핵심기술 | 반도체 |
|---|---|---|---|
| 삼성전자 | 137 | 9 | 54 |
| TSMC | 74 | 1 | 71 |
| 퀄컴 | 65 | 2 | 3 |
| 애플 | 44 | 2 | 4 |
| IBM | 38 | 6 | 9 |
| 인텔 | 37 | 2 | 15 |
| LG전자 | 30 | 1 | 1 |
| LG디스플레이 | 29 | 0 | 17 |
| 에릭슨 | 29 | 3 | 0 |
| 델 | 28 | 7 | 0 |
| 마이크로소프트 | 24 | 5 | 0 |
| 알파벳(구글) | 24 | 7 | 1 |
| 마이크론 | 24 | 1 | 13 |
| 노키아 | 23 | 0 | 0 |
| 어플라이드머티어리얼즈 | 22 | 0 | 11 |
| 텍사스인스트루먼트 | 21 | 0 | 8 |
| 소니 | 20 | 2 | 7 |
| 시스코 | 20 | 1 | 0 |
| 아마존 | 19 | 3 | 0 |
| 오라클 | 13 | 2 | 0 |
나머지 64곳 보기
| 기업 | 전체 | AI 핵심기술 | 반도체 |
|---|---|---|---|
| 스냅 | 12 | 1 | 0 |
| ST마이크로일렉트로닉스 | 11 | 1 | 2 |
| 엔비디아 | 10 | 1 | 0 |
| LG이노텍 | 9 | 0 | 2 |
| 마벨 | 8 | 0 | 2 |
| 아데이아 | 8 | 0 | 1 |
| SAP | 8 | 3 | 0 |
| 어도비 | 8 | 0 | 0 |
| AMD | 7 | 0 | 4 |
| SK하이닉스 | 7 | 0 | 4 |
| 팔로알토네트웍스 | 7 | 2 | 0 |
| ASML | 6 | 0 | 0 |
| 삼성SDI | 6 | 0 | 2 |
| 메타 | 6 | 0 | 0 |
| HPE | 6 | 0 | 0 |
| LG화학 | 6 | 0 | 1 |
| 삼성전기 | 6 | 0 | 1 |
| 램버스 | 5 | 0 | 0 |
| Arm | 5 | 0 | 0 |
| 램리서치 | 5 | 0 | 4 |
| 코닝 | 4 | 0 | 1 |
| 샌디스크 | 4 | 0 | 2 |
| 웨스턴디지털 | 4 | 0 | 0 |
| ASE테크놀로지 | 4 | 0 | 3 |
| LX세미콘 | 3 | 0 | 1 |
| 시러스로직 | 3 | 0 | 0 |
| 인튜이트 | 3 | 1 | 0 |
| 액센츄어 | 3 | 1 | 0 |
| 아날로그디바이스 | 3 | 0 | 2 |
| 스카이웍스 | 3 | 0 | 1 |
| UMC | 3 | 0 | 2 |
| 마이크로칩 | 3 | 0 | 0 |
| 브로드컴 | 3 | 0 | 0 |
| HP | 3 | 0 | 0 |
| 시놉시스 | 3 | 1 | 0 |
| 인스타카트 | 2 | 0 | 0 |
| 아틀라시안 | 2 | 0 | 0 |
| 알리바바 | 2 | 0 | 0 |
| 코히어런트 | 2 | 0 | 0 |
| 테슬라 | 2 | 0 | 0 |
| 이베이 | 2 | 1 | 0 |
| 유니버설디스플레이 | 2 | 0 | 2 |
| 케이던스 | 2 | 0 | 0 |
| 팔란티어 | 2 | 0 | 0 |
| 세일즈포스 | 1 | 0 | 0 |
| 리프트 | 1 | 0 | 0 |
| NAVER | 1 | 0 | 0 |
| 삼성SDS | 1 | 0 | 0 |
| NXP | 1 | 0 | 0 |
| KLA | 1 | 0 | 0 |
| 루닛 | 1 | 0 | 0 |
| FICO | 1 | 0 | 0 |
| 오토데스크 | 1 | 0 | 0 |
| 텔레칩스 | 1 | 0 | 0 |
| 바이두 | 1 | 0 | 0 |
| 포티넷 | 1 | 0 | 0 |
| 일렉트로닉아츠 | 1 | 0 | 0 |
| 뷰노 | 1 | 1 | 0 |
| 씨게이트 | 1 | 0 | 0 |
| 코보 | 1 | 0 | 0 |
| 엔테그리스 | 1 | 0 | 1 |
| 이오테크닉스 | 1 | 0 | 0 |
| 피델릭스 | 1 | 0 | 1 |
| 서울반도체 | 1 | 0 | 1 |
많이 받은 기업의 특허
많이 받은 12곳만, 기업마다 AI·반도체 특허를 앞에 두고 최대 5건까지 보여 줘요(원문 제목, 누르면 구글 특허로 이동).
삼성전자 137건
- Semiconductor packageUS 12702067반도체
- Display apparatusUS 12702066반도체
- Semiconductor package and method of manufacturing the semiconductor packageUS 12702034반도체
- Semiconductor package and display apparatus including the sameUS 12702032반도체
- Semiconductor packageUS 12702019반도체
TSMC 74건
- Redistribution structure with copper bumps on planar metal interconnects and methods of forming the sameUS 12702078반도체
- Package and method for forming the sameUS 12702060반도체
- Package structure and method of manufacturing the sameUS 12702053반도체
- Frame edge reinforcement structure for package structures and methods of using the sameUS 12702052반도체
- Integrated circuit packages and methodsUS 12702051반도체
퀄컴 65건
- Integrated circuit bumps integrated with Tcoils coupled by way of a metallized viaUS 12701994반도체
- Quantized orthogonal modulationUS 12701601AI
- Full-functionality back power protection (BPP) input/output (I/O) circuit with overvoltage protection including electrostatic dischargeUS 12700727반도체
- Secure anti-fuse one time programmable bit cell designUS 12700467반도체
- Reasoning system for performing questioning and answeringUS 12699718AI
애플 44건
- Semiconductor package with local interconnect and chiplet integrationUS 12702028반도체
- Thermoelectric cooling modulesUS 12701916반도체
- Power switch designUS 12701791반도체
- High dynamic range image sensor with dual-carrier pixel architectureUS 12701336반도체
- Machine learning model training checkpointsUS 12699916AI
IBM 38건
- Thermal expansion matched chip module with integrated liquid coolingUS 12702004반도체
- Self-aligned via in double diffusion break to connect to backside interconnectsUS 12701984반도체
- Method and structure to form connector tabs in subtractive patterningUS 12701941반도체
- Chamfered MRAM device structureUS 12701926반도체
- Memory structure with non-ion beam etched MTJ and top electrodeUS 12701924반도체
인텔 37건
- Micro light emitting diode structures for efficient communication of an optical signalUS 12702068반도체
- Memory on package (MOP) with reverse CAMM (compression attached memory module) and CMT connectorUS 12702062반도체
- Glass core patches embedded in encapsulating material for packaged integrated circuit devicesUS 12702057반도체
- Substrate trench for improved hybrid bondingUS 12702044반도체
- Bumps comprising tin, cooper and bismuth for liquid metal socket interconnectsUS 12702042반도체
LG전자 30건
- Transfer device for semiconductor light emitting device and display device of semiconductor light emitting device using sameUS 12701821반도체
- Vehicle equipped with sound control deviceUS 12701376AI
- Water heater and method for controlling the sameUS 12701684
- Method and apparatus for transceiving data units via paired serving cells in wireless communication systemUS 12701635
- Method and device for informing about whether SL DRX operation is supported in NR V2XUS 12701632
LG디스플레이 29건
- Display deviceUS 12702012반도체
- Flexible display apparatusUS 12701910반도체
- Stretchable display deviceUS 12701909반도체
- Light emitting display deviceUS 12701903반도체
- Display apparatus having an auxiliary electrodeUS 12701902반도체
에릭슨 29건
- Network nodes and methods for handling machine learning models in a communications networkUS 12701051AI
- Decentralized federated machine-learning by selecting participating worker nodesUS 12699880AI
- Methods and apparatuses for troubleshooting a computer systemUS 12699616AI
- Extended contiguous sensing during sidelink discontinuous reception (SL-DRX)US 12701633
- Method and network node of wireless communication network for handling random accessUS 12701617
델 28건
- Optimizing lossy compression for nonhomogeneous multivariate black-box classification modelsUS 12700877AI
- Deploying instances of artificial intelligence (AI) models having different levels of computational complexity in a heterogeneous computing platformUS 12699922AI
- Method, electronic device, and computer program product for model training and duration predictionUS 12699919AI
- Method, electronic device, and computer program product for detecting model performanceUS 12699881AI
- Defense against adversarial example input to machine learning modelsUS 12699879AI
마이크로소프트 24건
- Automated root cause determination using a pre-trained generative modelUS 12701042AI
- Frequency mapping in the voiceprint domainUS 12700413AI
- Compute management engine in an artificial intelligence systemUS 12699837AI
- Determining generative search results document for queries using generative artificial intelligence models and arbitration modelsUS 12699740AI
- Graph-based labeling of heterogenous digital content itemsUS 12699733AI
알파벳(구글) 24건
- Power line design for sensors in display panelUS 12701892반도체
- Transcription based on speech and visual inputUS 12700409AI
- Pattern-based classificationUS 12699900AI
- Three-dimensional object detection using pseudo-labelsUS 12699894AI
- Batched reinforcement learningUS 12699891AI
관심 기업의 새 특허, 등록되는 주에 받아 보기
미국 특허청은 매주 화요일 특허를 등록해요. 관심 기업에 새 특허가 나오면 분야별로 정리해 보내는 알림을 12월에 열어요. 먼저 받아 볼 분은 이메일을 남겨 주세요.