7월 14일 미국 등록특허

기업별 새 특허

많이 받은 기업의 특허

많이 받은 12곳만, 기업마다 AI·반도체 특허를 앞에 두고 최대 5건까지 보여 줘요(원문 제목, 누르면 구글 특허로 이동).

삼성전자 153건

• Method for predicting defect in semiconductor deviceUS 12681074AI반도체
• Semiconductor packageUS 12685228반도체
• Semiconductor packagesUS 12685226반도체
• Semiconductor package and manufacturing method thereofUS 12685223반도체
• Semiconductor package and method for manufacturing the semiconductor packageUS 12685213반도체

퀄컴 101건

• Package comprising a chiplet located between an integrated device and a metallization portionUS 12685219반도체
• Self-aligned backside contact module for 3DIC applicationUS 12685120반도체
• Logic circuits including circuits of different heights and related method of fabricationUS 12684874반도체
• Folded series switchesUS 12684863반도체
• On-device personalization based on continual local user context learningUS 12684043AI

IBM 84건

• Sensor for thermal dissipation measurementUS 12685153반도체
• Wire structure for low resistance interconnectsUS 12685137반도체
• Interconnect through gate cut for stacked FET deviceUS 12685136반도체
• Local interconnect formation at double diffusion breakUS 12685135반도체
• Local frontside power rail with global backside power deliveryUS 12685134반도체

TSMC 78건

• Semiconductor device packages and methods of forming the sameUS 12685236반도체
• Fine pitch chip interconnect structure for bump bridge and high temperature storage improvement and methods for forming the sameUS 12685235반도체
• Bump integration with redistribution layerUS 12685203반도체
• Semiconductor chiplet device and interposerUS 12685198반도체
• Interposer via interconnect shapes with improved performance characteristics and methods of forming the sameUS 12685191반도체

델 60건

• Systems and methods for prioritizing ordersUS 12682312AI
• System and method for preventing introduction of poisoned training data to artificial intelligence modelsUS 12682234AI
• Automatic correlation of test logs with service ticketUS 12682222AI
• System and method for generation and distribution of security modelsUS 12682072AI
• Method, device and computer program product for generating neural network modelUS 12682041AI

애플 57건

• Transfer molding systems for semiconductor device packagingUS 12684696반도체
• Neural network processing managementUS 12684340AI
• Determining relevant information based on third party information and user interactionsUS 12681737AI
• Photodetectors integrated into thin-film transistor backplanesUS 12681344반도체
• 3D system and wafer reconstitution with mid-layer interposerUS 12681249반도체

에릭슨 41건

• Method and system for user equipment pairing in full duplex networks based on machine learningUS 12684607AI
• Reinforced federated learning utilizing multiple specialized machine learning agentsUS 12682281AI
• Collaborative machine learning whose result is stored in a shared memory controlled by a central deviceUS 12682237AI
• Methods and apparatuses for control of packet data connectionUS 12684649
• Reducing interference in a communications networkUS 12684566

알파벳(구글) 39건

• Determining watch time loss regions in media content itemsUS 12684179AI
• Machine-learned verification pipeline for sensor inputsUS 12683969AI
• Methods and apparatus localizing object(s) in vision dataUS 12682628AI
• Machine learning time series anomaly detectionUS 12682047AI
• Input data item classification using memory data item embeddingsUS 12681956AI

인텔 38건

• Package architecture with memory chips having different process regionsUS 12685222반도체
• Metal PCB for topside power deliveryUS 12685218반도체
• Composite IC die package including IC die directly bonded to front and back sides of an interposerUS 12685216반도체
• Multichip IC devices in glass medium and including an interconnect bridge dieUS 12685194반도체
• Direct bonding in microelectronic assembliesUS 12685189반도체

LG전자 34건

• Transfer substrate used for manufacturing display device, display device, and method for manufacturing display deviceUS 12684923반도체
• Display device comprising semiconductor light emitting elementUS 12684918반도체
• Display deviceUS 12684718
• Display device with basket attached to rear coverUS 12684717
• Display deviceUS 12684716

어플라이드머티어리얼즈 34건

• In-situ integrated wafer parameter detection system with remote plasma cleaningUS 12685095AI반도체
• Growth suppression deposition for CVD tungsten gap fill with thermal treatmentUS 12685115반도체
• Method to improve interconnect coefficient of thermal expansionUS 12685108반도체
• Ultra-thin layers by selective passivationUS 12685107반도체
• Method of multi-layer die stacking with die-to-wafer bondingUS 12685099반도체

아마존 32건

• Multimedia content encodingUS 12682610AI
• Accelerated transfer learningUS 12682282AI
• Mixing sparsity compressionUS 12682242AI
• Batch statistics accelerationUS 12682232AI
• Efficient statistical techniques for detecting sensitive dataUS 12682108AI