6월 9일 미국 등록특허

기업별 새 특허

많이 받은 기업의 특허

많이 받은 12곳만, 기업마다 AI·반도체 특허를 앞에 두고 최대 5건까지 보여 줘요(원문 제목, 누르면 구글 특허로 이동).

삼성전자 123건

• Method of fabricating semiconductor packageUS 12653079반도체
• Semiconductor device and method of manufacturing the sameUS 12653072반도체
• Semiconductor package and method of fabricating the sameUS 12653071반도체
• Chip-on-film semiconductor package and display apparatus including the sameUS 12653054반도체
• Semiconductor package having metal line spaced part from capacitor on second side of package substrateUS 12653044반도체

퀄컴 64건

• Direct N/P local interconnectUS 12653007반도체
• Adaptive transmission and transmission path selection based on predicted channel stateUS 12652602AI
• Customization feature vector feedback for machine learning components in wireless communicationUS 12652548AI
• Input scaling with convolutional layersUS 12651310AI
• Network-based artificial intelligence (AI) model configurationUS 12651142AI

TSMC 46건

• Under-bump-metallization structure and redistribution layer design for integrated fan-out package with integrated passive deviceUS 12653074반도체
• Package structure and method of manufacturing the sameUS 12653061반도체
• Semiconductor device and method of forming the sameUS 12653039반도체
• Semiconductor device and methodUS 12653036반도체
• Dummy dies for reducing warpage in packagesUS 12653031반도체

IBM 39건

• Double-sided integrated circuit with electrostatic guard ringUS 12653030반도체
• Stacked field-effect transistor device with backside cut for top source/drain accessUS 12653023반도체
• Negative-tone organic dielectric with fine metal pillar resolutionUS 12653009반도체
• Confined phase-change memory cell with self-aligned electrode and reduced thermal lossUS 12652969반도체
• Hybrid orientation channels and mixed orientation bottom epitaxyUS 12652855반도체

애플 33건

• Stacked multi-spectral image sensorUS 12652871반도체
• Avatar modeling and generationUS 12651411AI
• Digital assistant intelligence engineUS 12651020AI
• Dynamic temperature sensing cadenceUS 12650345반도체
• Flexible broadband microshield for electromagnetic interference and electrostatic dischargeUS 12652787

알파벳(구글) 32건

• Dynamic-length stateful tensor arrayUS 12651024AI
• Domain-specific conversational automated assistantUS 12651013AI
• Scalable foundation models for processing structured dataUS 12650970AI
• Radio link management to enable unpaired receiver paths of user equipmentUS 12652716
• Cellular API for satellite configurationsUS 12652644

델 31건

• Horizontal federated forest via secure aggregationUS 12651199AI
• Detection of adversarial example input to machine learning modelsUS 12651144AI
• Relationship-based data structure generation for enhanced visualization of information related to software products obtained from multiple data sourcesUS 12650817AI
• Tray handle design with multiple functionsUS 12652769
• Dynamic quality of service tagging on transport layerUS 12652572

LG전자 30건

• Method and apparatus for performing cell reselection in wireless communication systemUS 12652594AI
• Method for performing federated learning in wireless communication system, and apparatus thereforUS 12652123AI
• Artificial intelligence device for common sense reasoning for visual question answering and control method thereofUS 12651120AI
• Cooking appliance and control method thereofUS 12652734
• Random access method and apparatus in wireless communication systemUS 12652705

소니 28건

• Semiconductor device with through hole electrode wiringUS 12653012반도체
• Semiconductor device with storage elementUS 12652963반도체
• Imaging device and electronic apparatusUS 12652878반도체
• Solid-state imaging device and electronic deviceUS 12652874반도체
• Solid-state imaging apparatus and method for manufacturing the sameUS 12652873반도체

마이크론 26건

• Optimized sensor fusion in deep learning accelerator with integrated random access memoryUS 12651154AI반도체
• Semiconductor device assemblies and systems with improved thermal performance and methods for making the sameUS 12653077반도체
• Memory array structuresUS 12653067반도체
• Methods of forming microelectronic devices, and related microelectronic devices, memory devices, and electronic systemsUS 12653018반도체
• Advanced interconnection for wafer on wafer packagingUS 12653013반도체

인텔 22건

• Interconnection structure with liquid metal and surface pins and removable magnet or guideposts aligment around package substrateUS 12653078반도체
• Semiconductor package with stacked memory devicesUS 12653065반도체
• Hermetic seal for transistors with metal on both sidesUS 12653063반도체
• Composite bridges for 3D stacked integrated circuit power deliveryUS 12653047반도체
• Interconnect via metal-insulator-metal (MIM) fuse for integrated circuitryUS 12653027반도체

마이크로소프트 22건

• Temperature sensing of regions within a superconducting integrated circuit using in-situ resonatorsUS 12652965반도체
• Auto-generated collaborative components for collaboration objectUS 12652183AI
• Data driven approaches to improve understanding of process-based models and decision makingUS 12651145AI
• Enzymatic oligonucleotide assembly using hairpins and enzymatic cleavageUS 12649940반도체
• Tray with moveable connector for chassis side plane engagementUS 12652775