5월 26일 미국 등록특허

기업별 새 특허

많이 받은 기업의 특허

많이 받은 12곳만, 기업마다 AI·반도체 특허를 앞에 두고 최대 5건까지 보여 줘요(원문 제목, 누르면 구글 특허로 이동).

삼성전자 172건

• Semiconductor memory device employing processing in memory (PIM) and method of operating the semiconductor memory deviceUS 12639037AI반도체
• Semiconductor package and method of manufacturing the sameUS 12642151반도체
• Semiconductor package including redistribution structure and method for manufacturing the sameUS 12642148반도체
• Semiconductor packageUS 12642145반도체
• Semiconductor package and method of fabricating the sameUS 12642139반도체

TSMC 87건

• Package formation using UBM-first approach and the corresponding packagesUS 12642149반도체
• Multi-bump connection to interconnect structure and manufacturing method thereofUS 12642144반도체
• Method of forming a semiconductor structure including bonding a plurality of first semiconductor dies to a plurality of second semiconductor diesUS 12642142반도체
• Semiconductor package and manufacturing method thereofUS 12642141반도체
• Chip package structure including a silicon substrate interposer and methods for forming the sameUS 12642119반도체

퀄컴 86건

• Positioning model validity condition signaling and indicationUS 12641472AI
• Error handling for reprojection timelineUS 12640218반도체
• Enhanced deep sleep operations for multiple chip systemsUS 12638907반도체
• High airflow storage device array and related electronic modulesUS 12641744
• Multimode discontinuous reception in orbital angular momentum communicationsUS 12641678

델 59건

• Method, device, and computer program product for compressing point cloud dataUS 12641275AI
• Proactive alert aggregation and correlation management with automated summarizationUS 12639585AI
• Resource infrastructure prediction using machine learningUS 12639569AI
• Continual weighted retriever for RAG-based systemsUS 12639319AI
• Memory-aware input batch processing for large language modelsUS 12639204AI

애플 49건

• Computer housingUS 12638892반도체
• Systems and methods for broadcast signal utilization to improve mobile broadband servicesUS 12641627
• High band frequency PUCCH configurationsUS 12641609
• Unified TCI frameworkUS 12641599
• Signaling for power class fallback with transmission diversityUS 12641587

마이크론 48건

• Neuromorphic memory device and methodUS 12639236AI반도체
• Method for substrate moisture NCF voiding eliminationUS 12642095반도체
• Electronic devices comprising silicon carbide materialsUS 12642018반도체
• Dielectric engineered tunnel region in memory cellsUS 12641835반도체
• Integrated circuitry, memory arrays comprising strings of memory cells, methods used in forming integrated circuitry, and methods used in forming a memory array comprising strings of memory cellsUS 12641788반도체

LG전자 44건

• Display device comprising semiconductor light emitting elementUS 12642136반도체
• Method and apparatus for performing handover based on ai model in a wireless communication systemUS 12641508AI
• Display deviceUS 12638127반도체
• Display device with an inner plate of a corresponding size to a mounting portionUS 12641761
• Induction heating deviceUS 12641688

알파벳(구글) 44건

• Multi-layer chip architecture and fabricationUS 12642137반도체
• Feed-forward device fabricationUS 12642055반도체
• Conditional camera control via automated assistant commandsUS 12641334AI
• Voice-based chatbot policy override(s) for existing voice-based chatbot(s)US 12640150AI
• Generating high-resolution images using self-attentionUS 12639863AI

IBM 42건

• Regulated mobile ion synapsesUS 12641855AI반도체
• Metal insulator metal capacitor (MIM capacitor)US 12642085반도체
• Reduction of middle-of-line resistance and capacitanceUS 12642080반도체
• Integrated circuit chip with backside power delivery and multiple types of backside to frontside viasUS 12642077반도체
• Tetragonal half metallic heusler compoundsUS 12642007반도체

인텔 36건

• Die stacking package architecture for high-speed input/output with through-dielectric viasUS 12642132반도체
• Hybrid bonding a die to a substrate with vias connecting metal pads on both sides of the dieUS 12642130반도체
• Three-dimensional (3D) NAND component with control circuitry across multiple wafersUS 12642128반도체
• Ultra low loss and high-density routing between coresUS 12642120반도체
• Semiconductor package, base station, mobile device and method for forming a semiconductor packageUS 12642103반도체

마이크로소프트 35건

• Fabrication methodUS 12642010반도체
• Method and system for anomaly detectionUS 12641099AI
• AI agent interfaces and controls for email and other electronic communicationsUS 12641049AI
• Automatically building business intelligence modelsUS 12639652AI
• Recommendation system with time series data generated implicit ratingsUS 12639651AI

시스코 28건

• Liquid cooling using PCB through holesUS 12641716반도체
• Systems and methods for detection of phishing webpages through autoencoder techniquesUS 12641119AI
• Managing crosstalk for high data rate interfacesUS 12641711
• Managing networks to prevent signal floodingUS 12641504
• Optimizing roaming to mitigate sticky clients via machine learningUS 12641410