10월 6일 미국 등록특허

기업별 새 특허

많이 받은 기업의 특허

많이 받은 12곳만, 기업마다 AI·반도체 특허를 앞에 두고 최대 5건까지 보여 줘요(원문 제목, 누르면 구글 특허로 이동).

삼성전자 152건

• Semiconductor package comprising redistribution layer on wafer level chip scale package (WLCSP)US 12757805반도체
• Semiconductor packages having dummy postsUS 12757803반도체
• Semiconductor package and method of manufacturing the sameUS 12757796반도체
• Semiconductor package and method of manufacturing the sameUS 12757790반도체
• Semiconductor deviceUS 12757782반도체

퀄컴 84건

• Complementary field effect transistor (CFET) circuits with vertical routing structuresUS 12757483반도체
• Diode structure for direct backside contact, backside power delivery networkUS 12757457반도체
• Capability and configuration of a device for providing channel state feedbackUS 12756598AI
• Method and system for supporting memory functions during low power modes of a portable computing device (PCD)US 12754599반도체
• Photoacoustic sensor using micromachined ultrasonic transducersUS 12751631반도체

IBM 61건

• Power gating transistor for BSPDNUS 12757718반도체
• Vertical-transport field-effect transistors with shared backside power supplyUS 12757717반도체
• Single backside power plane for improved power deliveryUS 12757716반도체
• Method and structure for forming landing for backside power distribution networkUS 12757715반도체
• Through layer skip viaUS 12757713반도체

TSMC 52건

• Semiconductor device and method of forming the sameUS 12757802반도체
• Package structure with protective lidUS 12757797반도체
• Semiconductor package with stacked dies and thermal substrate encapsulationUS 12757780반도체
• Package structure including a package substrate and methods of forming the sameUS 12757773반도체
• Semiconductor package and manufacturing method thereofUS 12757764반도체

인텔 50건

• Copper rings for BGA count reduction in small form factor packagesUS 12757801반도체
• Patterned sheet MUF for complex packages and methods of producingUS 12757781반도체
• Gate-all-around transistor circuit modification using direct contact and/or access probe pointsUS 12757776반도체
• Silicon nitride layer under a copper padUS 12757774반도체
• TSV-type embedded multi-die interconnect bridge enabling with thermal compression non-conductive film (TC-NCF) processUS 12757761반도체

애플 41건

• Vertical transistors with backside power deliveryUS 12757371반도체
• Organic substrate for placing components of a cameraUS 12756912반도체
• Seamless continuation of communication sessionsUS 12757267
• Sidelink unlicensed (SL-U) gap symbol and cyclic prefix extension (CPE) configurationUS 12757248
• Downlink control information (DCI) transmission and receptionUS 12757219

델 38건

• Artificial intelligence model training for idle mode assistanceUS 12755203AI
• Intent-driven adaptive learning deliveryUS 12755198AI
• Ensuring compliance of data for use in a data pipeline with limitations on data collectionUS 12755172AI
• Automatic assessment of unsupervised models via trust scoring in unsupervised edge domainsUS 12755170AI
• Method for dynamic rule-based recommendation validationUS 12755167AI

LG전자 34건

• Display device related to micro-LED and manufacturing method thereforUS 12757537반도체
• Method and apparatus for bandwidth part switching for a multicast session in a wireless communication systemUS 12757293
• Method and apparatus for a DRX configuration for XR traffic in a wireless network systemUS 12757288
• Method and device for random access in wireless communication systemUS 12757256
• Method and apparatus for receiving PPDU by configuring multiple primary channels in wireless LAN systemUS 12757244

LG디스플레이 34건

• Display device that self assembles light emitting diodesUS 12757791반도체
• Display panel and display deviceUS 12757788반도체
• Organic light emitting diode and organic light emitting device including the sameUS 12757624반도체
• Organic light emitting display apparatus with a light guide member including a plurality of lenses with an atypical arrangement structureUS 12757619반도체
• Display deviceUS 12757614반도체

에릭슨 33건

• Handling of session contextUS 12757291
• Physical random access channel (PRACH) receiver for determining cells in which a preamble has been transmittedUS 12757250
• Resource selection for multiplexed transmissionUS 12757204
• Scheduling transmissions of internet of things devicesUS 12757185
• Control channel for wireless communicationUS 12757184

HPE 31건

• System and method of training heterogenous models using stacked ensembles on decentralized dataUS 12755211AI
• Unsupervised segmentation of a univariate time series dataset using motifs and shapeletsUS 12754934AI
• Configuring AP with MBSSID and MLO enabledUS 12757265
• Reliable frame transmission scheme for multi-link deviceUS 12757230
• Network power consumption allocation based on power consumption creditsUS 12757121

소니 30건

• Solid-state imaging device and imaging apparatusUS 12757513반도체
• Light detection element, electronic device, and manufacturing method of light detection elementUS 12756948반도체
• AI player model gameplay training and highlight reviewUS 12752193AI
• Terminal device, base station device, and communication methodUS 12757191
• Synthetic human ear with opposing microphones for detecting sound power/intensityUS 12756965