3월 3일 미국 등록특허

기업별 새 특허

많이 받은 기업의 특허

많이 받은 12곳만, 기업마다 AI·반도체 특허를 앞에 두고 최대 5건까지 보여 줘요(원문 제목, 누르면 구글 특허로 이동).

삼성전자 115건

• Semiconductor packageUS 12568868반도체
• Semiconductor package including under-bump protection patterns and method of manufacturing the semiconductor packageUS 12568867반도체
• Semiconductor packageUS 12568865반도체
• Micro semiconductor chip transfer substrate and method of manufacturing display apparatusUS 12568861반도체
• Semiconductor device including through-silicon via (TSV) test device and operating method thereofUS 12568860반도체

IBM 56건

• Wafer dies with thermally conducting perimeter regionsUS 12568846반도체
• Buried power rail directly contacting backside power delivery networkUS 12568814반도체
• Conformal dielectric cap for subtractive viasUS 12568806반도체
• Multifilament resistive memory with insulation layersUS 12568776반도체
• MRAM with a multi-component, multi-layer bottom electrodeUS 12568772반도체

퀄컴 50건

• Orthogonalization of a compressed channel state information reportUS 12568391AI
• Memory system with processor in memory (PIM)US 12566549반도체
• Techniques for voice call packet groupingUS 12568554
• Positioning system information blocks for network devices that implement power saving cyclesUS 12568552
• Considerations for multi-link aggregationUS 12568542

델 48건

• Method and system for performing data predictionUS 12566985AI
• Systems and methods for time-series based machine learning anomaly detection and preventionUS 12566652AI
• Generating temporal predictions for provisioning cloud resources using trained machine learning techniquesUS 12566643AI
• Predicting the next best compressor in a stream data platformUS 12566627AI
• Ultraviolet glue-controlled impedanceUS 12568572

알파벳(구글) 40건

• Active silicon D2D bridgeUS 12568834반도체
• Pin fin placement assembly for forming temperature control element utilized in device die packagesUS 12568821반도체
• Image and video coding using machine learning prediction coding modelsUS 12568208AI
• Restricting third party application access to audio data contentUS 12567409AI
• Processing of machine learning modeling data to improve accuracy of categorizationUS 12566997AI

TSMC 38건

• Semiconductor structure and method of manufacturing the sameUS 12568866반도체
• Semiconductor packages having semiconductor blocks surrounding semiconductor deviceUS 12568854반도체
• Dam for three-dimensional integrated circuitUS 12568849반도체
• Method for fabricating device dieUS 12568827반도체
• Package assembly including liquid alloy thermal interface material (TIM) and seal ring around the liquid alloy TIM and methods of forming the sameUS 12568824반도체

인텔 27건

• Power efficient register files for deep neural network (DNN) acceleratorUS 12566212AI반도체
• Secondary die with a ground plane for strip line routingUS 12568858반도체
• Patternable die attach materials and processes for patterningUS 12568831반도체
• Surface functionalization of sinx thin film by wet etching for improved adhesion of metal-dielectric for HSIOUS 12568817반도체
• Nanoribbon thick gate device with hybrid dielectric tuning for high breakdown and VT modulationUS 12568682반도체

LG전자 27건

• Display control module and display apparatus comprising sameUS 12568596반도체
• Method and device for performing federated learning in wireless communication systemUS 12568000AI
• Route guidance device and route guidance system based on augmented reality and mixed realityUS 12567206AI
• MR service platform for providing mixed reality automotive meta service and control method thereofUS 12567205AI
• Artificial intelligence device and smart home cooking system including artificial intelligence deviceUS 12566810AI

애플 27건

• Phase detection autofocus pixelUS 12568705반도체
• Visual search for electronic devicesUS 12567252AI
• Monitoring a user of a head-wearable electronic deviceUS 12566489AI
• Flexible aperiodic SRS triggering in a cellular communication systemUS 12568516
• Techniques for activity based wireless device coexistenceUS 12568480

에릭슨 25건

• Methods and apparatuses for performing federated learningUS 12567976AI
• Multi-link communication in a wireless communication networkUS 12568540
• Configuration for UE energy consumption reduction featuresUS 12568523
• Mixed signal DCI and multi-DCI for PDSCH schedulingUS 12568502
• Multiple downlink semi-persistent scheduling configurations for New Radio Internet of ThingsUS 12568493

소니 23건

• Imaging device and electronic apparatus including light condensing optical system for reducing parasitic light sensitivityUS 12568704반도체
• Solid-state imaging device and electronic device for enhanced color reproducibility of imagesUS 12568703반도체
• Light reception element and electronic apparatusUS 12568702반도체
• Semiconductor unit, semiconductor module, and electronic apparatusUS 12568672반도체
• Circuitries and methodsUS 12568228AI

어플라이드머티어리얼즈 21건

• Method of in-situ selective metal removal via gradient oxidation for gapfillUS 12568804반도체
• Methods of forming interconnect structuresUS 12568803반도체
• Chemical-dose substrate deposition monitoringUS 12568800반도체
• Passive separation cassette and carrierUS 12568797반도체
• Semiconductor process equipmentUS 12568796반도체